New York VCs and Angels Reveal Funding Secrets for Internet Startups

New York City's major venture capital funds and business angel investor groups will host 'Financing Your Internet Startup!' event on Wednesday, June 4 during Internet Week New York

The Tech Virtual Summit: Discussing Digital Democracy in Exhibit Design

WHAT: The Tech Museum of Innovation (The Tech), one of the nation's premier science and technology museums, invites you to attend a symposium and roundtable discussion focused on how the open source spirit and social and virtual worlds are impacting museums in an age of participation. Keynote speakers include Philip Rosedale, ...

Phoenix Center Study finds US Adopting Broadband on Par With Most OECD Countries

“Broadband Efficiency Index” Examines Role That Demographic and
Economic Differences Play in Broadband Adoption
Read more

Qualcomm Introduces Next-Generation Solution for a Better Bluetooth Experience

- Smaller, More Power-Efficient Design Provides Integration and Cost
Advantages for Handset Makers -

SAN DIEGO, May 28 /PRNewswire-FirstCall/ — Qualcomm Incorporated
(Nasdaq: QCOM), a leading developer and innovator of advanced wireless
technologies and data solutions, today announced the latest addition to its
line of Bluetooth solutions which delivers an enhanced user experience and
significant advantages for handset manufacturers. Bluetooth technology
provides short-range wireless connectivity between handsets headsets and
other Bluetooth-enabled devices. Qualcomm’s new BTS4025(TM)
system-on-a-chip (SoC) — which is now sampling — offers full support for
the latest Bluetooth 2.1 + Enhanced Data Rate (EDR) specification, as well
as improved radio-frequency performance in a significantly smaller, more
power-efficient package than previous Bluetooth chips. The technology
innovations found in the BTS4025 SoC enable better Bluetooth performance,
which can now be more readily available in mid- to low-tier handsets
requiring lower costs and smaller form factor solutions.

“This new Bluetooth solution builds on the significant market traction
gained with our first-generation BTS4020 Bluetooth solution,” said Mike
Concannon, senior vice president of product management for Qualcomm CDMA
Technologies. “As one of the industry’s smallest and more power-efficient
Bluetooth devices, the BTS4025 SoC raises the bar in terms of mainstream
and entry-level handset performance.”

The BTS4025 SoC’s compact 3.2 x 2.9mm chip scale package is
significantly smaller than any comparable solution. The BTS4025 SoC
requires very few external components and can use the existing system
clock, allowing for both space savings and easy integration. The BTS4025
SoC extends battery life by reducing the stand-by current consumption by up
to 50 percent when the device is scanning for other Bluetooth devices. In
addition, the BTS4025 SoC enables up to +13 dBm transmit power through
efficient integration of a high- performance on-chip power amplifier. The
increased output power improves the connection reliability and range
between Bluetooth device pairs, such as handsets and headsets, to enhance
the end user experience.

Qualcomm’s BTS4025 SoC solution is optimized for interfacing with
certain Mobile Station Modem(TM) (MSM(TM)) chipsets and Qualcomm Single
Chip(TM) (QSC(TM)) solutions that provide the complete Bluetooth upper
layer stack and profiles, giving device manufacturing partners complete
turnkey Bluetooth solutions for mobile handsets. The first handsets using
the new chips should be available on the market later this year.

Qualcomm Incorporated (http://www.Qualcomm.com) is a leader in
developing and delivering innovative digital wireless communications
products and services based on CDMA and other advanced technologies.
Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500
Index and is a 2008 FORTUNE 500(R) company traded on The Nasdaq Stock
Market(R) under the ticker symbol QCOM.

Except for the historical information contained herein, this news
release contains forward-looking statements that are subject to risks and
uncertainties, including the Company’s ability to successfully design and
have manufactured significant quantities of CDMA components on a timely and
profitable basis, the extent and speed to which CDMA is deployed, change in
economic conditions of the various markets the Company serves, as well as
the other risks detailed from time to time in the Company’s SEC reports,
including the report on Form 10-K for the year ended September 30, 2007,
and most recent Form 10-Q.

Qualcomm is a registered trademark of Qualcomm Incorporated. Mobile
Station Modem, MSM, Qualcomm Single Chip, QSC, and BTS4020 are trademarks
of Qualcomm Incorporated. All other trademarks are the property of their
respective owners.

Qualcomm Contacts:
Kira Lee Golin, Qualcomm CDMA Technologies
Phone: 1-858-651-1554
Email: qctpublicrelations@Qualcomm.com

Emily Kilpatrick, Corporate Communications
Phone: 1-858-845-5959
Email: corpcomm@Qualcomm.com

John Gilbert, Investor Relations
Phone: 1-858-658-4813
Email: ir@Qualcomm.com

SOURCE Qualcomm Incorporated

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Microsoft HealthVault Be Well Fund Increased to $4.5 Million

Distinguished panel of judges to select winning online health applications Read more

„California Tech Showcase“: Innovativste Technologiefirmen stellen sich Topexperten

Innovativste Technologiefirmen stellen sich Topexperten bei der ?California Tech Showcase? vom 4. bis 6. Juni 2008 im französischen La Baule vor California Tech Showcase 2008

Online Storage Provider Diino Reaches Milestone - 1 Million Users Worldwide

STOCKHOLM, May 26 /PRNewswire/ — Diino, a market leading online
storage provider, now has more than one million users, and the demand for
online based storage solutions is rapidly increasing amongst residential
users and SMEs. Read more

Sports Fans Growing the Video Game Industry, CEA Study Finds

Next Generation Game Systems Drive Sales to New Heights.

SuperBlade(TM) Wins Best-of-Class Green IT Award

Supermicro's latest SuperBlade(TM) solutions won the Best Green Data Center Solution award at BladeSystems Insight 2008 over such notables as HP, IBM, Dell and Sun. Supermicro DatacenterBlade(TM) and OfficeBlade(TM) systems feature 93%* power supply efficiency and deliver unprecedented performance-per-watt when combined with Supermicro thermal and design technologies.

Ecosystems Summit 2008 Scheduled for June 25-26 in Denver

Conference to focus on channel, partner and strategic alliance programs for software and IT companies

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